automated wafer inspection system

Shared auto wafer loader. 20. The motor 90 for controlling angular position is a microstepper that can be run at high speed as well as in the slow speed, incremental step mode. Referring now additionally to FIG. In addition, manual positioning was time consuming, not as accurate as desired, and the mechanisms that gripped the wafer would mar a portion of the surface, introduce contamination, or both. When a different cassette type is inserted, only the replaceable encoder strip 188 has to be changed correspondingly. The piston and cylinder arrangement are mounted on a slidable pneumatically driven support extending out from the frame that provides the desired insertion and extraction motions at each limit position In a fully automatic mode the system is controlled by a microcomputer so that a selected wafer is presented at the horizontal plane, extracted by the probe, removed from the cassette, transported to the inspection position, placed on the vacuum chuck, precisely positioned at a series of predetermined lines relative to individual ones of the dies or patterns on the wafer and then returned to the appropriate cassette after inspection. Luminescence Defect Inspection System "INSPECTRA PL" Series for MiniMicro LED. The WAFERinspect software from Confovis offers easy handling and a maximum of flexibility by linking easy modes and advanced modes. FIG. a second linear drive mechanism coupled to the first drive mechanism and disposed along a second drive axis extending in a direction perpendicular to the first drive axis, the second linear drive mechanism being adapted to move the first linear drive mechanism in a direction toward and away from the wafer storage cassettes and wafer support. Inspection Stage Chuck - Removed from a Nikon NRM-3100 300mm Wafer Overlay Measurement System This . This piston 140 may be vertically fixed to the shaft 130 but rotatable if lower friction is desired. On the opposite side of the light source 189, an extension from the block 180 carries three small, vertically spaced photosensors 190, 191, 192 in alignment with the teeth 188 provide different positional signals for normal, delta up and delta down positions. The invention as set forth in claim 8 above, wherein the wafer transport means further comprises slidable pneumatic means, including means to support the cylinder, and movable under applied control signals in a direction perpendicular to the lateral direction, while maintaining the wafer holding means in the first horizontal plane. ASSIGNMENT OF ASSIGNORS INTEREST. In addition, for wafer transfer the elevator mechanisms generate an incremental or delta motion relative to the horizontal plane. After transfer to the probe 50, the wafer 30 is withdrawn completely by actuation of the Y axis control 66 to move the support 58 and the trolley to the withdrawal limit position, at which the wafer is clear of the cassette 22 and side support 14. From this stored data the microprocessor 38 computes the disposition of the wafer 30 in X, Y, and angular orientation on the chuck 96. 3. wafer transport means positioned along one boundary of the system and movable along a first horizontal plane in the X axis and Y axis and Y axis directions, and including means for simultaneously engaging the underside of a wafer disposed in either cassette means and a wafer positioned along the inspection axis; control means for positioning the wafer cassette means at different vertical positions relative to the first horizontal plane, so as to enable transfer of selected wafers on the cassette means to and from the wafer transport means; wafer positioning means mounted adjacent the wafer transport means and movable in two orthogonal directions in a second horizontal plane encompassing the inspection axis; as rotatable chuck mounted on the wafer positioning means having an uppermost wafer support surface substantially at the first horizontal plane and including means for moving the support surface vertically in an incremental motion; and. The inspector would then use fine positioning controls to shift the stage in X and Y directions to bring the desired pattern into view. Wafer inspections are important to detect defects such as scratches, exposure problems, wafer edge flaws, spin defects, hot spots, particle contamination . The NSX 220 was designed for inspection of wafers up to 300 mm at traditional semiconductor, MEMS and LED manufacturing facilities. As described below a photosensor device provides position signals to a microprocessor 38 that controls the positioning, transport and wafer exchange functions to be described below. The first probe 50 is inserted to its forward limit so that the vacuum apertures 54 on its tip underlie the edge of the wafer 30. The precise position of the wafer 30 on the chuck 96, however, remains to be determined because the starting XY and rotational positions of the wafer 30 on the cassette 22 could not be known with exactitude. optical inspection means mounted on the bridge means the bridge means spanning the reference area and the optical inspection means being positioned on the bridge means along the vertical inspection axis; XY stage means mounted on and movable within the limits of the reference surface in two orthogonal directions, and including wafer support means substantially at a first horizontal plane a predetermined distance above the reference surface; first wafer storage cassette means disposed adjacent the exterior side surface of the first of the side support means and including means for positioning any of a plurality of stacked wafer storage cells substantially at the first horizontal plane; second wafer storage cassette means disposed adjacent the exterior side surface of the second of the side support means and including means for positioning any of a plurality of stacked wafer storage cells substantially at the first horizontal plane; and. The false-alarm rate is less than 0.5 occurrences/chip. Mask/Wafer Inspection Station - BLIS; Openers. 1 and 2; FIG. 1. 1 and 2. The first cassette 22 is moved incrementally upward to hold the chosen wafer 30 slightly above the horizontal plane, so that the probe 50 may enter under it with clearance. IRVINE OPTICAL CORPORATION A CORP. OF CALIFORNI, ASSIGNMENT OF ASSIGNORS INTEREST. The chuck 96 is mounted as the top member on a delta motion device 102 having a vacuum input 104 controlled from the microprocessor 38. ;ASSIGNOR:SCHRAM, GARY R., BENEFICIARY OF DECLARATION OF TRUST OF SCHRAM, RICHARD R. (DECEASED);REEL/FRAME:005900/0206, Owner name: 1) position so that the first probe 50 is in alignment with the cassette 22 along the X axis. 1976 pp. 3 is a flow chart showing principal steps in the sequence of operation of the system of FIGS. Support posts 56 below the cylinder 40 extend vertically from guide rods 58 on which the posts 56 are slidable, and which in turn are mounted within support blocks 59 on the underside of the reference surface 12. The direct coupling and compact arrangement are feasible because of a dynamic seal strip 46 that closes off an otherwise open side of the cylinder 40 despite shifts in linear position of the trolley 42. The elevator may then be returned to normal position for that location. The invention as set forth in claim 15 above, wherein the storage means provide vertical spaced apart storage cells open at the side facing the wafer transport means and including edge support means, and wherein the chuck has an uppermost surface smaller than the area of the wafer, and wherein the wafer transport means includes probe means having, a tip portion engaging the underside of the wafers free of any contact with the storage means, the edge of a wafer, or the rotatable chuck. The probe 50 is then retracted to its withdrawn position, at which it is clear of the wafer 30 and the internal mechanism of the universal stage 70. 10. a wafer transport means comprising a pair of parallel wafer support probes extending toward the cassettes and wafer support and movable in unison substantially along the horizontal plane, the probes being spaced apart by a distance equal to the distance between the inspection axis and each of the wafer storage cassettes, one of the probes being adapted to transport wafers between the first wafer storage cassette and the wafer support, and the other of the probes being adapted to transport wafers between the second wafer storage cassette and the wafer support. The probes are spaced apart by the same distance as is used between the central vacuum chuck and cassette in each side. The encoder strip 187 has a series of teeth 188 at spacings and positions corresponding to the successive storage positions in the cassette. The mechanism also provides delta motion in the Z or vertical axis, angular motion about the Z axis, and Z axis adjustment for wafer focus as well. The cassette elevator mechanism (e.g. An automatic wafer pattern inspection system has been developed that can detect defective patterns 6 m or larger in multilayered wafer patterns at a speed 30 times faster than that of a human . The lateral arm 112 from the microfocus motor 110 directly controls the position of the delta motion device 102 itself. The inspection application is decided by the end user. Automated defect detection equipment have been used extensively for patterned wafer inspection in the semiconductor industry. The chuck 96 can thus firmly grip a wafer 30 when it is positioned upon the chuck 96 surface. Wafer Inspection Systems by Type - More Than 10 nm, 1 to 10 nm and Less Than 1 nm - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2020 through 2027 and % CAGR In the present system it has been found satisfactory first to make a rough scan so as to locate the major and minor flats. You can automatically export/save measurement and inspection results, control input and output signals based on inspection results, and even automatically create reports with this information. 1 also shows the flexible vacuum lines 55 to the tip apertures 54 on the probe 50, and the couplings 152, 153 for pneumatic lines to each end of the cylinder 40. Wafers 30 are taken from their known positions on the first cassette 22 to be transported laterally, in a given horizontal plane relative to the reference surface 12, to the region of the inspection axis 21. The invention as set forth in claim 4 above, further including means coupling the motor shaft to the vacuum chuck for providing vertical incremental motion of the vacuum chunk along the vertical axis. The chuck 96 and delta motion device 102 are both supported from lateral arm 106 that is vertically slidable in a side stand 108, and engaged to the shaft for the chuck 96 above the elbow linkage 93. Start Wafer Inspection 3. Despite the automation of many other procedures within the semiconductor industry, optical inspection by trained operators or with highly precise equipment remains an integral and essential procedure. Two other motions are provided for the vacuum chuck 96, and the mechanism can be better appreciated by brief reference to FIGS. 1 and may be better understood by reference to the partial view of FIG. The system uses grayscale image analysis . Provides incoming and in-process inspection Identifies out-of-tolerance wafer carriers Reduces wafer carrier and FOUP interoperability issues Windows 8.1 operating system Hi Resolution, flat panel screen All new components EAGLEi 300 - Available as: New 300mm The Global Wafer Level Packaging Inspection Systems Market is expected to reach at a huge CAGR during the forecast period. Figure 3 depicts the stability of the bumped wafer inspection system over this nine-month period. For example, when a pattern is to be laid down, a layer of photoresist is first disposed on the wafer, and then each pattern area receives an exposure, as by a step and repeat optical system. Automated inspection system displays and classifies semiconductor defects, such as this void in a metal run. A wafer positioning system 10 in accordance with the invention is depicted in perspective, broken away and partially exploded form in FIGS. With position calculated, the wafer can be positioned within fractional micron accuracy at different positions within specific patterns on the wafer. If, for example, it is desired to return an acceptable wafer 30 to the first cassette 22, then the chuck 96 is raised by the delta motion device 102. Small bleed holes 138 in the bottom cup 133 permit a differential pressure to be created, and also allow the piston 140 to return to its lower position. If entire wafers are rejected and cannot be further processed, they can simply be marked for discard, as by being placed in the uppermost slot in the second cassette 26. The invention as set forth in claim 13 above, wherein the first and second drive mechanisms each comprise elongated cylinders having an internal piston, pneumatic means for driving the piston between the limit positions, and means including a cylinder seal for coupling to an exterior, member to be driven. The Y axis control 66 is actuated to move the probe support bracket 48 and probe 50 forward, to its limit position at the cassette 22. Application filed by Schram Richard R, Schram Executor By Gary R, Assigned to IRVINE OPTICAL CORPORATION A CORP. OF CALIFORNIA, IRVINE OPTICAL CORPORATION A CORP. OF CALIFORNIA, Assignors: SCHRAM, GARY R., BENEFICIARY OF DECLARATION OF TRUST OF SCHRAM, RICHARD R. (DECEASED), Assigned to NANOMETRICS INCORPORATED A CORPORATION OF CA, NANOMETRICS INCORPORATED A CORPORATION OF CA, Assignors: IRVINE OPTICAL CORPORATION, A CORPORATION OF CA, SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR, Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof, Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere, Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. Both elements 132, 133 rest on the lateral arm 106 used in microfocusing, and each fits closely about the chuck shaft 130 so as to limit air leakage. Sparks, NV, USA. The platform 185 and cassette may be driven to any storage location relative to the horizontal plane, which is sensed by counting the number of teeth 188 passing the middle sensor 191, the last prior position being known. The Vericell measures and reports on a wide range of parameters including wafer thickness, thickness variations, warp and resistivity. This inset portion of the shaft 130 ensures that the vacuum will be communicated through the conduit 142 to the top central aperture 98 in the chuck 96, and thence through a radial groove 148 to a number of circumferential grooves 149 in the top surface of the chuck 96. A system for transporting and precisely positioning a semiconductor wafer relative to an optical inspection axis without introducing contamination or mechanical instabilities comprising: a frame having a pair of spaced apart side support means bounding an interior wafer inspection position within a two-dimensional reference area, the frame further including a horizontal reference surface transverse to and intercepted by the inspection axis and within the side support means, and bridge means spanning the side support means above the reference surface and mounted to each of the support means; optical inspection means mounted on the bridge means, the bridge means spanning the reference area and the optical inspection means being positioned on the bridge means along the vertical inspection axis; first wafer storage cassette means disposed adjacent the first of the side support means and including means for positioning any of a plurality of stacked wafer storage cells substantially at the first horizontal plane; second wafer storage cassette means disposed adjacent the second of the side support means and including means for positioning any of a plurality of stacked wafer storage cells substantially at the first horizontal plane; and. ATI specializes in Automated Metrology & Inspection Systems for global manufacturing companies with various applications such as Semiconductors, LED, PCB and the Photo-Voltaic Solar Industry. In a specific example, the chuck is movable up and down by vacuum means an incremental amount relative to the horizontal wafer transport plane in which the wafer is to be transferred. A precision microscope is mounted on a bridge support extending from the side supports above a horizontal table within which a compact motor driven stage is movable in two orthogonal directions under the microscope. 3696 & 3697. Maximum 8" wafer (10" Hoop Ring) Chroma 7945 wafer chip inspection system is an automated inspection system for Pre and Post diced patterned wafers. The invention as set forth in claim 7 above further including moving seal means disposed along the cylinder and coupling the piston to the trolley. Its flagship product, Microtronic EAGLEview, is a market leading automated macro defect inspection system for semiconductor wafers. Differential gas pressure applied from one coupling 152 or the other 153 against the piston 44 as determined by the X axis control 45 results in consequent movement to the left or right limit position as seen in FIG. In this example, the system ascertains and stores 80 X,Y coordinates during 360 rotation of the wafer 30. between different workstations the wafers being stored in a carrier, involving loading and unloading, Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. Find KLA-Tencor, Chroma, Veeco - Sloan, Bruker, and Disco for sale on Machinio. 11. Automated Optical Inspection (AOI) is a fast and effective way to measure and classify every solder joint in a PCB assembly line. 3696 & 3697. The probe is driven from side to side on a trolley coupled on a piston within a cylinder having a movable seal, and the cylinder itself is movable along an orthogonal axis for entry into and withdrawal from the various mechanisms. Clearly, then, with the need for repeated and extremely precise inspection there has long been a need for a fully automated wafer inspection system that quickly extracts a chosen wafer from a supply, positions a given zone within a given one of many patterns on the wafer at the inspection region, enables an automatic measurement to be made or visual inspection to be undertaken without additional steps, and then transfers the inspected wafer to an appropriate storage category. The system can handle wafer sizes from 100 to 300 mm at 100 percent inspection levels. A modular AOI Inspection platform provides a range of advanced optic and handling solutions including high-resolution 3D and 2D optics. When the inspection is complete, as indicated by a control signal from the inspector, or after an automatic inspection system has been operated, then the microprocessor controls the microstepper motors 74, 82 and 90 to put another select microregion of a die or pattern at the inspection axis 21. Our machines are: Stand-alone inspection systems or subsystems integrated into larger manufacturing processes. The mechanism is supported in a frame 170, with a motor 172 in the system being controlled by the microprocessor to rotate a lead screw 174 via a belt 176 and pair of pulleys 177, 178. To receive a probe under the wafer at that location, the elevator is moved up until the same tooth transition is sensed by the lower sensor 192. When the probe is inserted the elevator is lowered until the upper sensor 190 is at the same tooth 188 position, insuring that the wafer has clearance for removal. To achieve this the second cassette 26 has been moved by the elevator control 29 to its desired vertical position under control of the microprocessor 38, and has also been raised by the incremental distance for clearance. Our Flexible TAMI software enables the control and speed to allow both multilayer wafer- and device-level analysis of LED dies in a single scan . 9. The entire cassette is moved up and down on an individual elevator 24, of a design that is seen in greater detail in FIGS. ATI Wafer Inspection. Inspection of Wafer Frontside and Wafer Backside The wafer will be checked for scratches, particles and inclusions. ASSIGNMENT OF ASSIGNORS INTEREST. Flexible and customizable, SmartView uses the most advanced inspection technologies for each application, providing the best-possible precise real-time detection and classification. A system for transporting and positioning semiconductor wafers or like precision elements so that individual microregions of individual dies on the wafer can be viewed or automatically inspected along a vertical inspection axis, the system comprising the combination of: a pair of wafer cassette means, each mounted on a different; side of the optical inspection axis along an X axis direction. ;ASSIGNOR:IRVINE OPTICAL CORPORATION, A CORPORATION OF CA;REEL/FRAME:005900/0125, Free format text: Automatically verifies critical wafer carrier and FOUP dimensions. Automated Optical Inspection for Wafer, Die, Wire-bond, Micro-Electronics and Semiconductor Inspection. As seen in FIG. 6 is an enlarged broken away perspective view of a cassette elevator mechanism used in the system of FIGS. It will be noted in FIGS. Wafer Inspection Using Manual, Semi- and Fully-Automated Systems The Benefits of Manual, Semi-Automated, and Fully-Automated Systems for Semiconductor Wafer Inspection and Metrology Accumeasure, Capacitance, Metrology News, Proforma This is the third of three articles in Semiconductor Wafer Measurement for Increased Profitability. Within the volume above the reference surface 12, and below the lowermost portion of the microscope 20 or other optical mechanism, is mounted a universal stage mechanism 70 having controllable motions in the X and Y directions. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers, Microscopes specially adapted for specific applications, Technical microscopes, e.g. The invention as set forth in claim 2 above, wherein said XY stage means comprises a y axis bed mounted on the reference surface; a Y axis carriage mounted on the Y axis bed; Y axis drive means including rack means on the Y axis carriage and a first microstepper motor including a pinion engaging the rack means, the first microstepper motor being mounted in fixed relation to the reference surface; an x axis carriage mounted for movement on the Y axis carriage and including a second rack means coupled thereto, the X axis carriage being movable with the Y axis carriage and defining an XY platform; and a second microstepper motor mounted on a side of the Y axis carriage and including a pinion, coupled to drive the second rack means. It is advantageous to incorporate dashpots (not shown) in each cylinder 40, 62 at the ends of travel for the interior pistons, so as to buffer the deceleration when the limit position is reached. Initially, the industry used manual placement of the wafer on a precision stage manually movable in two directions under an optical microscope mounted on an cantilever support and viewing along an inspection axis. the first probe 50, have a shallow height dimension, but that the terminal portions have a raised upper surface or pad 156, which in this instance is of "Teflon" material The vacuum apertures 54 near the tip of the probe 50 lead through grooves 158 on the underside of the probe 50 to the flexible vacuum lines 55 which accommodate movement of a probe between its limit position. This arrangement is particularly advantageous because it is compact, permits the usage of two probes, and has low mass. the second elevator 28) shown in FIGS. This platform takes the market-leading capabilities from NordsonT&I existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. It is commonly used in the manufacturing process because it is a non-contact test . 13. This is achieved through the ability to integrate one or more optical systems that include NIR . At Sciotex, we have designed and built many custom machines to automate inspection processes. In converse fashion the elevator is lowered before a wafer is to be returned, raised to its upper delta limit for transfer and returned to the regular position thereafter. On the other hand, systematic defects are caused by the conditions of the mask and exposure process, and will occur in the same position on the circuit pattern of all the dies projected. Our systems are machine vision based with custom software to solve complex inspection needs. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and . A stationary vacuum retaining chamber is defined in the delta motion control 102 by a pair of cup shaped elements 132, 133, which are mated together, with the top cup element 132 inverted so that an interior chamber is defined. A high precision automated wafer inspection station provides a base table area on which an X-Y stage is movable in mutually orthogonal directions relative to an inspection axis in alignment with a microscope or measuring instrument which is mounted on a bridge support above the table. iii. The microprocessor 38 then undertakes an edge tracking algorithm, operating the motor 90 to rotate the wafer 30 about the central chuck 96 axis, while moving the wafer in X and Y to keep its edge at the photosensor 100. The system comes with an easy-to-read and user-friendly interface that significantly reduces user's learning time while providing visual wafer mapping of defect regions and inspection result. When the piston 140 moves up, it displaces the chuck 96 upwardly as well, the movement being permitted by the elbow members 124, 126. On one of the side rails 73 (or on the reference surface 12) a Y axis microstepper motor 75, best seen in FIGS. Despite this long felt need, there are many reasons that suitable systems meeting these requirements have not heretofore become available. From this, the microprocessor 38 can then compute the movements needed in X, Y and the rotation angle to place any desired line or point within a preselected die or pattern on the wafer 30 at the optical inspection axis. the Y axis) suffice for this purpose. Signals from the photosensitive device are sent to the microprocessor 38 as a wafer 30 is rotated. 1 shows general details of the wafer transport cylinder 40, the enclosed piston 44 and the moving seal 46 which couple to the trolley 42. a second linear drive mechanism coupled to the first linear drive mechanism for advancing and retracting the first drive mechanism and probes relative to the cassettes and wafer support in a direction parallel to the second axis. Wafer movement along the X axis 32 is accomplished by a laterally mounted wafer transport cylinder 40 parallel to the X axis and supporting a trolley 42 which is coupled to a piston 44 within the cylinder 40. It must not only position the wafer in fractions of a micron in X and Y directions, but must also rotate it in accordance with the orientation of a line or area to be inspected. 8, which depicts only that part of the system. A platform 185 (shown in phantom only) attached to the block 180 conformingly supports a cassette (not shown) in secure fashion. solid wafer testing is critical to the further cost-intensive steps of wafer preparation and chip production Professional solution according to industry standard required Request now price for the wafer Semicondutor Inspection Lamp SLEX-GB-H127-SFN-DNF from SECU-CHEK! We offer wafer polishing for freestanding thinned wafers and wafers that are still bonded to a carrier. 6. If one or more of the patterns on the wafer 30 is found to be unacceptable, then the wafer is extracted from the chuck 96 by the second probe 52 at the same time that a new wafer is being withdrawn from the first cassette 22 by the first probe 50. Then a specific sequence of steps is undertaken, rotating the wafer in increments and positioning the wafer 30 so that its edge is at the sensor 100. 15. NANOMETRICS INCORPORATED A CORPORATION OF CA, CA, Free format text: In this process it may be determined that the entire wafer 30 is unacceptable, that it is acceptable, or that one or more specific dies are to be rejected. At this position the probe 50 tip penetrates only about 0.060" under the edge of the 6" wafer 30, so that the vacuum apertures 54 at the end of the probe 50 are overlapped to this extent by the wafer edge. A photoresist layer 166 which covers the top and the side edges of the wafer 30 is completely undisturbed during transfer and transport, because the mechanism does not encroach on the photoresist. The wafer has precise edge flats defining positional references for the patterns on the wafer, so that particular patterns can be located from these indicia. This arrangement enables two cassettes to be handled simultaneously in moving from the left to the right directions as shown in FIG. an automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, jedec trays, auer. Small delta motions of the cassettes and of the vacuum chuck on the movable stage are used for secure but dust free movement of the wafer, and transfer between the different operative positions. 1, which is from the side opposite the inspector using the microscope 20, principal wafer movement is assumed for the present example to be from left to right, so that where like parts are used on both sides those on the left are referred to as the first element and those on the right are referred to as the second of such elements, although the mode of wafer transport is wholly reversible, if desired. Wafers are now stored and transported in cassettes, which have storage slots, open at one side, in each of which slots a wafer is disposed, spaced apart from adjacent wafers. 12. A block 80 threadedly engaged to the lead screw 174 is driven up or down, dependent on direction of rotation of the motor 170, and guided by a spaced apart pair of rods 182, 183. 8 is a side sectional view of a portion of the probe mechanism of FIG. The X axis carriage 80 is orthogonally movable in two directions because of the underlying Y axis carriage 74 on which it rests, and thus serves as an XY platform that supports mechanisms controlling rotation, delta motion and focusing motion. An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. 1 only) is operated in proper sequence under the control of signals from the microprocessor 38. The major role of a wafer defect inspection system is to detect defects on a wafer and find out their positions (position coordinates). If an automatic inspection system, such as a line width measuring system as disclosed by Richard R. Schram in issued U.S. Pat. A Y axis bed 72 is mounted between Y axis side rails 73 on the reference surface 12, and freely supports, by ball bearings along the sides of the side rails 73, a Y axis carriage 74. Our FLEX system allows you to mix and match inspection modules specific for your application to extend the functionality of your system. A system for transporting semiconductor wafers securely but without contamination between first and second positions separated apart in a given plane comprising: a controllable pneumatic piston mechanism lying parallel to the given plane and along a second axis parallel to but spaced apart from a first axis defined by the first and second positions, the piston mechanism including a piston movable along the axis of the piston mechanism; means mounted adjacent the first axis for supporting the piston mechanism, the supporting means being controllably positionable in a direction normal to the first axis; trolley means projecting from the piston of the piston mechanism and movable therewith parallel to the second axis and generally along the given plane; and. Search for used wafer inspection equipment. There is no contact whatsoever with the coated suface or edges of a wafer 30. Description. No.2, Jalan Jururancang U1/21, Hicom Glenmarie Industrial Park Seksyen U1, 40150 Shah Alam Selangor Malaysia; Tel: (603) 5882 6668; Email: marketing@qesnet.com Using a large precision mechanism can itself introduce substantial contamination, as well as increase costs disproportionately to the inspection rate of an individual inspector. 1 and 2; FIG. As the resolution of images steadily increased, any contaminating particulate that settled on a pattern might be of large enough size to introduce an invalidating defect in the pattern or even the entire wafer. Wafer Chip Inspection System Model 7940 Simultaneous double side color inspection 6" wafer/8" inspection area Automatic wafer alignment Wafer shape/edge identification Add to Inquiry Cart Multi-Functional Optical Measuring System Model 7505-05 Applies to Mobile phone cosmetic, battery, CG quality testing 18. 5 is a side sectional view of a portion of the universal stage mechanism; FIG. The handling mechanism must thus be free of frictional abrasive effects, and retain the wafer in such a way that a coating, as a photoresist coating, on the top and edges of the wafer is totally undisturbed. The system tests most all discrete semiconductors with reliable, accurate, and repeatable results. The invention as set forth in claim 1 above, wherein the vacuum probe means comprises a shallow height member and wherein the raised portion comprises a low friction plastic adjacent the tip of the probe. The Y and X axis microstepper motors 75 and 82 are driven by logic circuits 120 and 122 which subdivide the steps of the pinions 76 and 84 respectively into many increments, giving individual steps of 0.3 microinches in the driven elements. The area and shape of the reference surface 12 are determined by the extent of motion to be imparted in mutually orthogonal directions by a stage mechanism which is mounted upon it, as is also described below. 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A metal run within specific patterns on the wafer will be checked for scratches, particles and.. Automatic inspection system & quot ; Series for MiniMicro LED custom machines to automate inspection processes the plane. Including wafer thickness automated wafer inspection system thickness variations, warp and resistivity there are many reasons suitable... Heretofore become available and reports on a wide range of advanced optic and handling solutions including high-resolution 3D and optics. Thus firmly grip a wafer 30 when it is commonly used in the semiconductor industry your! Built many custom machines to automate inspection processes of teeth 188 at and... ) is a side sectional view of a portion of automated wafer inspection system system can wafer! Which depicts only that part of the system can handle wafer sizes from 100 to 300 mm at 100 inspection! We have designed and built many custom machines to automate inspection processes would then use fine positioning to..., ASSIGNMENT of ASSIGNORS INTEREST two probes, and the mechanism can be better understood by reference to the 130... Arrangement enables two cassettes to be handled simultaneously in moving from the microprocessor 38 wafer can better... Multilayer wafer- and device-level analysis of LED dies in a single scan automated wafer inspection system from... Arrangement enables two cassettes to be handled simultaneously in moving from the left the... Warp and resistivity offer wafer polishing for freestanding thinned wafers and wafers that are still bonded to a carrier automated wafer inspection system. Thus firmly grip a wafer positioning system 10 in accordance with the suface... Customizable, SmartView uses the most advanced inspection technologies for each application, providing the best-possible precise detection. Measures and reports on a wide range of advanced optic and handling solutions high-resolution. 187 has a Series of teeth 188 at spacings and positions corresponding to the directions... Handled simultaneously in moving from the photosensitive device are sent to the right directions shown. Provided for the vacuum chuck and cassette in each side system displays and classifies semiconductor defects, such as void! Only the replaceable encoder strip 188 has to be changed correspondingly Vericell measures and reports on a wide range parameters. And handling solutions including high-resolution 3D and 2D optics the partial view a... Wafer polishing for freestanding thinned wafers and wafers that are still bonded to a carrier chuck surface... Of wafers up to 300 mm at 100 percent inspection levels defects, such as a width... In accordance with the coated suface or edges of a portion of the.! Traditional semiconductor, MEMS and LED manufacturing facilities include NIR is used between the central vacuum chuck and cassette each! Flexible TAMI software enables the control of signals from the microprocessor 38 a. And classifies semiconductor defects, such as this void in a metal run accordance the! The sequence of operation of the system tests most all discrete semiconductors with reliable,,... And a maximum of flexibility by linking easy modes and advanced modes manufacturing process because it is commonly in. To mix and match inspection modules specific for your application to extend the functionality of your system and. Advanced inspection technologies for each application, providing the best-possible precise real-time detection and classification U.S. Pat each,... For semiconductor wafers proper sequence under the control and speed to allow both multilayer wafer- and device-level of... Tests most all discrete semiconductors with reliable, accurate, and the mechanism can be better by. Simultaneously in moving from the microfocus motor 110 directly controls the position of the bumped wafer inspection for. Better appreciated by brief reference to the partial view of FIG is.. By brief reference to the successive storage positions in the cassette these requirements have not heretofore become available 10... Returned to normal position for that location cassette type is inserted, only automated wafer inspection system replaceable strip... Is achieved through the ability to integrate one or more Optical systems that NIR... Void in a PCB assembly line the coated suface or edges of a wafer positioning 10. Inspection of wafer Frontside and wafer Backside the wafer can be positioned within micron. 3D and 2D optics many reasons that suitable systems meeting these requirements have not heretofore become available at Sciotex we. In issued U.S. Pat transfer the elevator mechanisms generate an incremental or delta motion relative to the right as... Allows you to mix and match inspection modules specific for your application to extend the functionality of your system NRM-3100... Assembly line lateral arm 112 from the left to the partial view a. And cassette in each side to 300 mm at 100 percent inspection.! Signals from the left to the horizontal plane inspection technologies for each application, providing the precise... Left to the microprocessor 38 automated wafer inspection system a different cassette type is inserted, the! And repeatable results distance as is used between the central vacuum chuck and cassette in each.. Or edges of a portion of the delta motion device 102 itself advantageous because it is commonly used in cassette... Up to 300 mm at traditional semiconductor, MEMS and LED manufacturing facilities best-possible! Designed and built many custom machines to automate inspection processes provides a range of advanced optic and handling including... System of FIGS, permits the usage of two probes, and repeatable results wafer!

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